Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | Yamaichi Electronics |
| Series | IC |
| Packaging | Tray |
| Part Status | Active |
| Type | QFP |
| Number of Positions or Pins (Grid) | 144 |
| Pitch – Mating | 0.020″ (0.50mm) |
| Contact Finish – Mating | Gold |
| Contact Finish Thickness – Mating | – |
| Contact Material – Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch – Post | 0.020″ (0.50mm) |
| Contact Finish – Post | – |
| Contact Finish Thickness – Post | – |
| Contact Material – Post | – |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | -40°C ~ 170°C |
| Termination Post Length | – |
| Material Flammability Rating | – |
| Contact Resistance | 30mOhm |
Değerlendirmeler
Henüz değerlendirme yapılmadı.