Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | Aries Electronics |
| Series | 547 |
| Packaging | Bulk |
| Part Status | Active |
| Type | SOIC, ZIF (ZIP) |
| Number of Positions or Pins (Grid) | 44 (2 x 22) |
| Pitch – Mating | – |
| Contact Finish – Mating | Gold |
| Contact Finish Thickness – Mating | 20.0µin (0.51µm) |
| Contact Material – Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch – Post | 0.050″ (1.27mm) |
| Contact Finish – Post | Gold |
| Contact Finish Thickness – Post | 20.0µin (0.51µm) |
| Contact Material – Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | – |
| Termination Post Length | 0.150″ (3.81mm) |
| Material Flammability Rating | UL94 V-0 |
| Current Rating (Amps) | 1 A |
| Contact Resistance | – |
| Base Product Number | 44-547 |
Değerlendirmeler
Henüz değerlendirme yapılmadı.