Açıklama

ÖZELLİK	AÇIKLAMA
Manufacturer	Aries Electronics
Series	55
Packaging	Bulk
Part Status	Active
Type	DIP, ZIF (ZIP), 0.6″ (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch – Mating	0.100″ (2.54mm)
Contact Finish – Mating	Gold
Contact Finish Thickness – Mating	–
Contact Material – Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch – Post	0.100″ (2.54mm)
Contact Finish – Post	Gold
Contact Finish Thickness – Post	–
Contact Material – Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	–
Termination Post Length	0.110″ (2.78mm)
Material Flammability Rating	UL94 V-0
Current Rating (Amps)	1 A
Contact Resistance	–
Base Product Number	28-6554