Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | Aries Electronics |
| Series | 55 |
| Packaging | Bulk |
| Part Status | Active |
| Type | DIP, ZIF (ZIP), 0.6″ (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Pitch – Mating | 0.100″ (2.54mm) |
| Contact Finish – Mating | Nickel Boron |
| Contact Finish Thickness – Mating | 50.0µin (1.27µm) |
| Contact Material – Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch – Post | 0.100″ (2.54mm) |
| Contact Finish – Post | Nickel Boron |
| Contact Finish Thickness – Post | 50.0µin (1.27µm) |
| Contact Material – Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | – |
| Termination Post Length | 0.110″ (2.78mm) |
| Material Flammability Rating | UL94 V-0 |
| Current Rating (Amps) | 1 A |
| Contact Resistance | – |
| Base Product Number | 28-6551 |
Değerlendirmeler
Henüz değerlendirme yapılmadı.