Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | Aries Electronics |
| Series | Lo-PRO®file, 513 |
| Packaging | Bulk |
| Part Status | Active |
| Type | DIP, 0.2″ (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch – Mating | 0.100″ (2.54mm) |
| Contact Finish – Mating | Gold |
| Contact Finish Thickness – Mating | 10.0µin (0.25µm) |
| Contact Material – Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch – Post | 0.100″ (2.54mm) |
| Contact Finish – Post | Tin |
| Contact Finish Thickness – Post | 200.0µin (5.08µm) |
| Contact Material – Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 105°C |
| Termination Post Length | 0.125″ (3.18mm) |
| Material Flammability Rating | UL94 V-0 |
| Current Rating (Amps) | 3 A |
| Contact Resistance | – |
| Base Product Number | 08-2513 |
Değerlendirmeler
Henüz değerlendirme yapılmadı.