Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | 3M |
| Series | Textool™ |
| Packaging | Bulk |
| Part Status | Active |
| Type | SOIC |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch – Mating | – |
| Contact Finish – Mating | Gold |
| Contact Finish Thickness – Mating | 30.0µin (0.76µm) |
| Contact Material – Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch – Post | – |
| Contact Finish – Post | Gold |
| Contact Finish Thickness – Post | 30.0µin (0.76µm) |
| Contact Material – Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES), Glass Filled |
| Operating Temperature | -55°C ~ 150°C |
| Termination Post Length | 0.140″ (3.56mm) |
| Material Flammability Rating | UL94 V-0 |
| Current Rating (Amps) | 1 A |
| Contact Resistance | – |
| Base Product Number | 208 |
Değerlendirmeler
Henüz değerlendirme yapılmadı.