Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | Laird Technologies EMI |
| Series | SMD Grounding Metallized |
| Packaging | Tape & Reel (TR), Cut Tape (CT) |
| Part Status | Active |
| Type | Film Over Foam |
| Shape | Rectangle |
| Width | 0.394″ (10.00mm) |
| Length | 0.394″ (10.00mm) |
| Height | 0.394″ (10.00mm) |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Plating | – |
| Plating – Thickness | – |
| Attachment Method | Solder |
| Operating Temperature | -40°C ~ 70°C |
| Shelf Life Start | Date of Shipment |
| Shelf Life | 24 Months |
| Storage/Refrigeration Temperature | – |
Değerlendirmeler
Henüz değerlendirme yapılmadı.