Açıklama
| ÖZELLİK | AÇIKLAMA |
|---|---|
| Manufacturer | Samtec Inc. |
| Series | Edge Rate™ HSEC8 |
| Packaging | Tray |
| Part Status | Active |
| Card Type | Non Specified – Dual Edge |
| Gender | Female |
| Number of Positions/Bay/Row | 40; 2; 2 |
| Number of Positions | 84 (80 + 4 Power) |
| Card Thickness | 0.062″ (1.57mm) |
| Number of Rows | 2 |
| Pitch | 0.031″ (0.80mm) |
| Read Out | Dual |
| Features | Board Guide, Solder Retention |
| Mounting Type | Surface Mount, Through Hole |
| Termination | Solder |
| Contact Material | Beryllium Copper |
| Contact Finish | Gold |
| Contact Finish Thickness | 10.0µin (0.25µm) |
| Contact Type | Cantilever |
| Color | Black |
| Flange Feature | – |
| Operating Temperature | -55°C ~ 125°C |
| Material – Insulation | Liquid Crystal Polymer (LCP) |
| Base Product Number | HSEC8-140 |
Değerlendirmeler
Henüz değerlendirme yapılmadı.